panasonic corporation automation controls business unit industrial.panasonic.com/ac/e/ ayf31 acctb9e 201204-t ordering information for fpc y3ft series fpc connectors (0.3mm pitch) front lock with fpc tabs features 1. low-pro?e, space-saving design (pitch: 0.3mm) the 0.9mm height, 3.0mm depth contributes to the miniaturization and thickness reduction of target products. * the total depth including the lever is 3.2mm. 2. fpc with tabs ensures high reliability through secure connectibility thanks to a design in which the fpc tab portion attaches to the protruding resin part, depth is reduced making the product more compact. also makes it possible to securely position the fpc during insertion and prevent diagonal insertion. (y3f is compatible with fpc without tabs.) 3. soldering terminals for higher mounting strength 4. easy-to-handle front lock structure 5. wiring patterns can be placed underneath the connector. 6. ni barrier with high resistance to solder creep applications mobile devices, such as cellular phones, smartphones, digital still cameras and digital video cameras. rohs compliant 3.0 17.35 (51 pin contacts) 0.9 unit: mm fpc tabs to prevent diagonal insertion and ensure reliable holding soldering terminals resistant to twisting 31: fpc connector 0.3 mm pitch (front lock, zif type with fpc tabs) ayf 3 1 51 number of pins (2 digits) contact direction 1: bottom contact surface treatment (contact portion / terminal portion) 5: au plating/au flash plating (ni barrier)
panasonic corporation automation controls business unit industrial.panasonic.com/ac/e/ ayf31 acctb9e 201204-t product types notes: 1. order unit; for volume production: 1-inner carton (1-reel) units samples for mounting check: 50-connector units. please contact our sales of?e. 2. please contact our sales of?e for connectors having a number of pins other than those listed above. specifications 1. characteristics 2. material and surface treatment height number of pins pa rt number pac king inner carton outer carton 0.9 mm 11 ayf311115 5,000 pieces 10,000 pieces 13 ayf311315 15 ayf311515 17 ayf311715 23 ayf312315 25 AYF312515 27 ayf312715 29 ayf312915 31 ayf313115 33 ayf313315 35 ayf313515 39 ayf313915 41 ayf314115 45 ayf314515 51 ayf315115 item speci?ations conditions electrical characteristics rated current 0.2a/pin contact rated voltage 50v ac/dc insulation resistance min. 1,000m ? (initial) using 250v dc megger (applied for 1 min.) breakdown voltage 150v ac for 1 min. no short-circuiting or damage at a detection current of 1 ma when the speci?d voltage is applied for one minute. contact resistance max. 80m ? based on the contact resistance measurement method speci?d by jis c 5402. mechanical characteristics fpc holding force min. 0.23n/pin contacts pin contacts (initial) measurement of the maximum force applied until the inserted compatible fpc is pulled out in the insertion axis direction while the connector lever is closed environmental characteristics ambient temperature ?5 c to +85 c no freezing at low temperatures. no dew condensation. storage temperature ?5 c to +85 c (product only) ?0 c to +50 c (emboss packing) thermal shock resistance (with fpc inserted) 5 cycles, insulation resistance min. 100m ? , contact resistance max. 80m ? conformed to mil-std-202f, method 107g humidity resistance (with fpc inserted) 120 hours, insulation resistance min. 100m ? , contact resistance max. 80m ? bath temperature 40 2 c, humidity 90 to 95% r.h. saltwater spray resistance (with fpc inserted) 24 hours, insulation resistance min. 100m ? , contact resistance max. 80m ? bath temperature 35 2 c, saltwater concentration 5 1% h 2 s resistance (with fpc inserted) 48 hours, contact resistance max. 80m ? bath temperature 40 2 c, gas concentration 3 1 ppm, humidity 75 to 80% r.h. soldering heat resistance peak temperature: 260 c or less re?w soldering 300 c within 5 sec. 350 c within 3 sec. soldering iron lifetime characteristics insertion and removal life 30 times repeated insertion and removal: min. 10 sec./time unit weight 51 pin contact type: 0.09 g pa rt name material surface treatment molded portion housing: lcp resin (ul94v-0) lever: lcp resin (ul94v-0) contact copper alloy contact portion; base: ni plating, surface: au plating te r minal portion; base: ni plating, surface: au plating soldering terminals portion copper alloy base: ni plating, surface: au plating order temperature ( c) time (minutes) 1 2 3 4 ?5 85 ?5 0 ? 3 30 max. 5 30 max. 5 + 3 0 0 ? 3
panasonic corporation automation controls business unit industrial.panasonic.com/ac/e/ ayf31 acctb9e 201204-t dimensions (unit: mm) recommended fpc dimensions embossed tape dimensions (unit: mm) (common for respective contact type) ?dimension table (unit: mm) number of pins type of taping a b c quantity per reel max. 17 tape i 16.0 7.5 17.4 5,000 23 to 45 tape i 24.0 11.5 25.4 5,000 51 tape ii 32.0 14.2 33.4 5,000 the cad data of the products with a cad data mark can be downloaded from: http://industrial.panasonic.com/ac/e/ (contact and soldering terminals) te r minal coplanarity 0.1 (1.50) (140 ) when the lever is opened (fpc insertion depth) 3.20 0.300.20 0.90 0.10 3.00 (2.07) b 0.20 c 0.20 (0.12) (0.12) 0.30 0.53 (0.15) d 0.20 0.30 0.10 (terminal pitch) 0.60 0.10 (terminal pitch) 0.60 0.10 (terminal pitch) a 1.12 (suction area) number of pins/ dimension a b c d 11 5.35 2.40 3.00 4.40 13 5.95 3.00 3.60 5.00 15 6.55 3.60 4.20 5.60 17 7.15 4.20 4.80 6.20 23 8.95 6.00 6.60 8.00 25 9.55 6.60 7.20 8.60 27 10.15 7.20 7.80 9.20 29 10.75 7.80 8.40 9.80 31 11.35 8.40 9.00 10.40 33 11.95 9.00 9.60 11.00 35 12.55 9.60 10.20 11.60 39 13.75 10.80 11.40 12.80 41 14.35 11.40 12.00 13.40 45 15.55 12.60 13.20 14.60 51 17.35 14.40 15.00 16.40 cad data 3.50 min. (reinforcing plate) 0.20 0.03 (contact width) +0.04 ?.03 0.30 (contact width) +0.04 ?.03 0.30 2.20 0.30 (exposed part of the conductor) 0.20 max. r0.10 c0.25 r0.20 0.48 0.15 0.85 0.15 a 0.1 0.20 0.02 (0.10) b 0.05 0.20 0.02 0.10 max. 1.53 0.10 0.80 0.10 1.70 0.15 1.60 0.15 1.50 0.15 1.05 0.15 0.30 0.07 0.60 0.07d 0.03 0.60 0.02 0.60 0.07 c 0.03 0.30 0.02 0.30 0.07 0.60 0.02 cutting direction cut fpc from the copper foil side to the reinforcing plate side. (finished thickness: t = 0.2 0.03) the conductive parts should be based by ni plating and then au plating. number of pins/ dimension a b c d 11 4.10 3.60 3.00 2.40 13 4.70 4.20 3.60 3.00 15 5.30 4.80 4.20 3.60 17 5.90 5.40 4.80 4.20 23 7.70 7.20 6.60 6.00 25 8.30 7.80 7.20 6.60 27 8.90 8.40 7.80 7.20 29 9.50 9.00 8.40 7.80 31 10.10 9.60 9.00 8.40 33 10.70 10.20 9.60 9.00 35 11.30 10.80 10.20 9.60 39 12.50 12.00 11.40 10.80 41 13.10 12.60 12.00 11.40 45 14.30 13.80 13.20 12.60 51 16.10 15.60 15.00 14.40 ?speci?ations for taping ?speci?ations for the plastic reel (in accordance with eiaj et-7200b.) a 0.30 tape i tape ii a 0.30 (2.0) 8.0 8.0 (4.0) (2.0) (4.0) (1.75) (1.75) (b) (b) 28.40 leading direction after packaging 1.50 dia. +0.1 0.0 1.50 dia. +0.1 0.0 embossed mounting-hole taping reel top cover tape embossed carrier tape 380 dia. (c 1)
panasonic corporation automation controls business unit industrial.panasonic.com/ac/e/ ayf31 acctb9e 201204-t ?connector orientation with respect to embossed tape feeding direction notes type direction of tape progress y3ft 1. recommended pc board and metal mask patterns connectors are mounted with high pitch density, intervals of 0.3 mm or 0.5 mm. in order to reduce solder bridges and other issues make sure the proper levels of solder is used. the ?ures to the right are recommended metal mask patterns. please use them as a reference. recommended pc board pattern (mounting layout) (top view) recommended metal mask pattern metal mask thickness: here, 120 m (front terminal portion opening area ratio: 50%) (back terminal portion opening area ratio: 51%) (soldering terminal portion opening area ratio: 100%) 2. precautions for insertion/removal of fpc to open the lever, hold its center and pull it up. an uneven load applied to the lever on one side may deform and break the lever. do not apply an excessive load to the lever in the opening direction, otherwise, the terminals may be deformed. don? further apply an excessive load to the fully opened lever; otherwise, the lever may be deformed. fully open the lever to insert an fpc. since this product connects at the bottom, please insert the fpc so that its electrode plane is facing the board to which it will be mounted. do not insert the fpc in the reverse direction of the contact section; otherwise, operation failures or malfunctions may be caused. this product has a structure to position an inserted fpc using the fpc tabs. therefore, insert an fpc at an angle to the board. if the fpc is inserted in the direction parallel to the board, the molded positioning parts block the fpc, leading to incomplete insertion. an fpc inserted at an excessive angle to the board may cause the deformation of metal parts, fpc insertion failures, and fpc circuit breakages. insert the fpc to the full depth of the connector without altering the angle. when closing the lever, carefuly use the tip of your ?ger to push the entire lever or both sides of it. if pressure to the lever is applied unevenly, ie: only the edge, it may deform or break the fpc. make sure that the lever is closed completely. not doing so will cause a faulty connection. av oid applying an excessive load to the top of the lever during or after closing the lever. otherwise, the terminals may be deformed. remove the fpc at an angle with the lever fully opened. if the lever is closed, or if the fpc is forcedly pulled into a direction parallel to the board, the molded part may break. after an fpc is inserted, carefully handle it so as not to apply excessive stress to the base of the fpc. 0.70 0.03 0.60 0.03 0.40 0.10 0.03 0.50 0.03 3.20 0.03 0.30 0.03 0.60 0.03 0.30 0.03 0.60 0.03 0.45 0.03 0.70 0.03 area of exposed soldering terminal area of exposed soldering terminal 2.94 0.01 2.26 0.01 0.055 0.01 0.60 0.01 (0.29) (0.39) 0.27 0.01 0.60 0.01 0.27 0.01 0.60 0.01 0.45 0.01 0.70 0.01 (140 ) fpc fpc positioning part please refer to the latest product speci?ations when designing your product.
panasonic corporation automation controls business unit industrial.panasonic.com/ac/e/ acctb13e 201204-t notes on using fpc connectors (common) pc board design design the recommended foot pattern in order to secure the mechanical strength in the soldered areas of the terminal. fpc and equipment design design the fpc based with recommended dimensions to ensure the required connector performance. when back lock type is used, secure enough space for closing the lever and for open-close operation of the lever. due to the fpc size, weight, or the reaction force of the routed fpc. carefully check the equipment design and take required measures to prevent the fpc from being removed due to a fall, vibration, or other impact. connector mounting excessive mounter chucking force may deform the molded or metal part of the connector. consult us in advance if chucking is to be applied. soldering 1) manual soldering. ?due to the connector s compact size, if an excessive amount of solder is applied during manual soldering, the solder may creep up near the contact points, or solder interference may cause imperfect contact. ?make sure that the soldering iron tip is heated within the temperature and time limits indicated in the speci?ations. ?flux from the solder wire may adhere to the contact surfaces during soldering operations. after soldering, carefully check the contact surfaces and clean off any ?x before use. ?be aware that a load applied to the connector terminals while soldering may displace the contact. ?thoroughly clean the iron tip. 2) re?w soldering ?screen-printing is recommended for printing paste solder. ?to achieve the appropriate soldering state, make sure that the re?w temperature, pc board foot pattern, window size and thickness of metal mask are recommended condition. ?note that excess solder on the terminals prevents complete insertion of the fpc, and that excess solder on the soldering terminals prevents the lever from rotating. ?consult us when using a screen-printing thickness other than that recommended. ?depending on the size of the connector being used, self alignment may not be possible. accordingly, carefully position the terminal with the pc board pattern. ?the recommended re?w temperature pro?e is given in the ?ure below recommended re?w temperature pro?e ?the temperature is measured on the surface of the pc board near the connector terminal. ?certain solder and ?x types may cause serious solder creeping. solder and ?x characteristics should be taken into consideration when setting the re?w soldering conditions. ?when performing re?w soldering on the back of the pc board after re?w soldering the connector, secure the connector using, for example, an adhesive. (double re?w soldering on the same side is possible) 3) reworking on a soldered portion ?finish reworking in one operation. ?for reworking of the solder bridge, use a soldering iron with a ?t tip. do not add ?x, otherwise the ?x may creep to the contact parts. ?use a soldering iron whose tip temperature is within the temperature range speci?d in the speci?ations. do not drop or handle the connector carelessly. otherwise, the terminals may become deformed due to excessive force or applied solderability may be during re?w degrade. don? open/close the lever or insert/ remove an fpc until the connector is soldered. forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. in addition, do not insert an fpc into the connector before soldering the connector. when cutting or bending the pc board after mounting the connector, be careful that the soldered sections are subjected to excessive force. other notes when coating the pc board after soldering the connector (to prevent the deterioration of insulation), perform the coating in such a way so that the coating does not get on the connector. the connectors are not meant to be used for switching. te r minal paste solder pc board foot pattern 150 c 180 c 230 c 220 c 200 c 260 c te mperature upper limit (soldering heat resistance) lower limit (solder wettability) preheating peak temperature time 25 sec. 70 sec.60 to 120 sec. please refer to the latest product speci?ations when designing your product. the soldered areas should not be subjected to force.
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